3D InCites Podcast
SEMI Europe’s 3D System Summit Panel: Partnering to Overcome Challenges in 3D Integration
For this week’s episode, we’re taking you to SEMI Europe’s 3D and System Summit, which took place last month in Dresden Germany. If you didn’t get to attend, you’re in luck, because in this episode, Françoise hands over the microphone to Jan Vardaman, who moderated a panel Panel Discussion titled: Customer-Supplier Partnering to Overcome Challenges in 3D. Industry experts Raja Swaminathan, of AMD; Andre Blum, of Audi; and Eric Beyne, imec lend their voices to the conversation.
The panel address the main drivers for 3D in different applications spaces. They also discuss the importance of partnerships and collaboration to implement heterogeneous integration solutions. There is a focus on evolving automotive electronics, and how 3D integration technologies are coming into their own to provide solutions as more advanced technology is needed alongside legacy node products.
Find the Panelists on LinkedIn
· Moderator – Jan Vardaman, Techsearch International
· Raja Swaminathan, AMD
· Andre Blum, Audi
· Eric Beyne, imec
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
For this week’s episode, we’re taking you to SEMI Europe’s 3D and System Summit, which took place last month in Dresden Germany. If you didn’t get to attend, you’re in luck, because in this episode, Françoise hands over the microphone to Jan Vardaman, who moderated a panel Panel Discussion titled: Customer-Supplier Partnering to Overcome Challenges in 3D. Industry experts Raja Swaminathan, of AMD; Andre Blum, of Audi; and Eric Beyne, imec lend their voices to the conversation.
The panel address the main drivers for 3D in different applications spaces. They also discuss the importance of partnerships and collaboration to implement heterogeneous integration solutions. There is a focus on evolving automotive electronics, and how 3D integration technologies are coming into their own to provide solutions as more advanced technology is needed alongside legacy node products.
Find the Panelists on LinkedIn
· Moderator – Jan Vardaman, Techsearch International
· Raja Swaminathan, AMD
· Andre Blum, Audi
· Eric Beyne, imec
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.