3D InCites Podcast
As a semiconductor industry community, IMAPS 3D InCites content platform and podcasts brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation. The IMAPS 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
3D InCites Podcast
Jean-Christophe Eloy and Jan Vardaman Explain How Chiplets and Advanced Packaging will Rule the World
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In this episode, Françoise von Trapp and Jean Christophe Eloy of Yole Group, discuss the future of advanced packaging and chiplets in the semiconductor industry, and how these technologies will revolutionize the industry.
Get ready for a deep dive into a technology discussion. From Jean-Christophe, you’ll learn how chiplets differ from multichip modules (MCM) and systems-in-package (SiP). He highlights the benefits of chiplets, including optimizing different nodes for specific functions. You’ll also learn about important enabling technologies that ensure the fast and robust connections that hallmark chiplets.
Françoise and Jean-Christophe also discuss the key applications using chiplets for their cost-savings and sustainability benefits.
In a bonus interview with Jan Vardaman of TechSearch International, Francoise and Jan discuss how chiplets provide the power efficiency needed for next-generation semiconductor devices.
Contact Our Speakers on LinkedIn:
- Jean-Christophe Eloy, President and CEO, Yole Group
- E. Jan Vardaman, President, Techsearch International
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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