3D InCites Podcast
LPKF Laser & Electronic’s Richard Noack Explains the Growing Importance of Glass Substrates for HPC and Chiplet Advanced Packaging
Glass has long been explored as an alternative substrate material to organic laminates and silicon. As high-performance computing and chiplets HPC push the boundaries of existing technology, they are demanding innovative packaging solutions, beginning with innovative substrate materials. This is paving the way for glass.
In this episode, Françoise von Trapp and Richard Noack discuss the highlights and takeaways from the recent webinar, Evolving HPC and Chiplet Packaging with Glass, and dive deeper into the motivation and trends that are bringing glass to the forefront.
They talk about the need for collaboration across the glass ecosystem and issue a call to action for downstream metrology companies to collaborate on developing solutions for measuring through transparent materials.
You’ll learn about the challenges of integrating glass into semiconductor production, such as the lack of reliability data, metrology processes, aspect ratio issues, metallization, and standardization.
You’ll also learn about the benefits of LPKF’s semiconductor manufacturing process, including adaptability, low to high-volume sampling, and a flexible process that can be tuned to meet industry needs.
Catch the replay of the webinar here
Find Richard Noack on Linked In here
A leading provider of laser manufacturing solutions for advanced semiconductor packaging and more.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Glass has long been explored as an alternative substrate material to organic laminates and silicon. As high-performance computing and chiplets HPC push the boundaries of existing technology, they are demanding innovative packaging solutions, beginning with innovative substrate materials. This is paving the way for glass.
In this episode, Françoise von Trapp and Richard Noack discuss the highlights and takeaways from the recent webinar, Evolving HPC and Chiplet Packaging with Glass, and dive deeper into the motivation and trends that are bringing glass to the forefront.
They talk about the need for collaboration across the glass ecosystem and issue a call to action for downstream metrology companies to collaborate on developing solutions for measuring through transparent materials.
You’ll learn about the challenges of integrating glass into semiconductor production, such as the lack of reliability data, metrology processes, aspect ratio issues, metallization, and standardization.
You’ll also learn about the benefits of LPKF’s semiconductor manufacturing process, including adaptability, low to high-volume sampling, and a flexible process that can be tuned to meet industry needs.
Catch the replay of the webinar here
Find Richard Noack on Linked In here
A leading provider of laser manufacturing solutions for advanced semiconductor packaging and more.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
