3D InCites Podcast
Siemens' AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs
Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing importance of digital twin technology in the semiconductor industry and the challenges of designing and optimizing 3D ICs, including the need for concurrent design across multiple disciplines.
You'll learn about:
- Evolution of semiconductor packaging from wire bond to heterogeneous integration and 3D stacking
- 3D IC design tools and their evolution
- Digital twins, chiplet architectures, and 3D integration processes in semiconductor design
- Innovator 3D IC - a new product " for faster, more predictable chip design
- Siemens' new 3D IC design platform for concurrent design and optimization.
- How design teams can take advantage of the digital twin and predictive analysis capabilities in Innovator 3D IC.
Learn more about Innovator 3D IC
Contact AJ Incorvaia on LinkedIn
Siemens' EDA software helps you turn today's ideas into the sustainable products of the future.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing importance of digital twin technology in the semiconductor industry and the challenges of designing and optimizing 3D ICs, including the need for concurrent design across multiple disciplines.
You'll learn about:
- Evolution of semiconductor packaging from wire bond to heterogeneous integration and 3D stacking
- 3D IC design tools and their evolution
- Digital twins, chiplet architectures, and 3D integration processes in semiconductor design
- Innovator 3D IC - a new product " for faster, more predictable chip design
- Siemens' new 3D IC design platform for concurrent design and optimization.
- How design teams can take advantage of the digital twin and predictive analysis capabilities in Innovator 3D IC.
Learn more about Innovator 3D IC
Contact AJ Incorvaia on LinkedIn
Siemens' EDA software helps you turn today's ideas into the sustainable products of the future.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
