3D InCites Podcast
3D InCites Members Share Perspectives from SEMICON West 2024
This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speakers discussed the need to reduce power consumption in AI chips, the potential of using interposers to connect dies without pads, and the ongoing talent crisis in the industry. They also highlighted the importance of sustainability and the potential for the industry to reach a trillion-dollar goal by 2030. Additionally, speakers discussed the expansion of companies in North America, the significance of UV laser debonding, and the investment in electric vehicles and carbon initiatives.
Speakers include:
- Ken McWilliams, of Multibeam Corporation, and Brad Ferguson of Skywater Technology
- Ram Trichur, Henkel Technologies
- Alan Weber, PDF Solutions
- Nirmalya Maity and Zia Karim, Yield Engineering Systems (YES)
- Martin Elzingre and Jeremy Sanner of Edwards
- Dave Kirsch and Thomas Uhrmann of EV Group
- Spencer Wall and Robert Green of DSV–IMS
- Chuck Byers, of Monozukuri (MZ Technologies)
- Meg Conkling, of Veeco
- Bernd Krafthofer of ERS Electronic GmbH
Welcome to The Brandon T. Adams Audio Experience, hosted by entrepreneur, investor,...
Listen on: Apple Podcasts Spotify
SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speakers discussed the need to reduce power consumption in AI chips, the potential of using interposers to connect dies without pads, and the ongoing talent crisis in the industry. They also highlighted the importance of sustainability and the potential for the industry to reach a trillion-dollar goal by 2030. Additionally, speakers discussed the expansion of companies in North America, the significance of UV laser debonding, and the investment in electric vehicles and carbon initiatives.
Speakers include:
- Ken McWilliams, of Multibeam Corporation, and Brad Ferguson of Skywater Technology
- Ram Trichur, Henkel Technologies
- Alan Weber, PDF Solutions
- Nirmalya Maity and Zia Karim, Yield Engineering Systems (YES)
- Martin Elzingre and Jeremy Sanner of Edwards
- Dave Kirsch and Thomas Uhrmann of EV Group
- Spencer Wall and Robert Green of DSV–IMS
- Chuck Byers, of Monozukuri (MZ Technologies)
- Meg Conkling, of Veeco
- Bernd Krafthofer of ERS Electronic GmbH
Welcome to The Brandon T. Adams Audio Experience, hosted by entrepreneur, investor,...
Listen on: Apple Podcasts Spotify
SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
