Community Members Share Insights from ECTC 2024

This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You’ll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substrates versus organic substrates. You’ll also learn about their latest technology advancements key takeaways from ECTC 2024. 

Guests include

• Vikas Gupta and Mark Gerber of ASE Group  
• Rao Bonda and Nathan Whitchurch of Amkor Technologies
• Eelco Bergman and Bart Deprospo of Saras Micro Devices 
• Simon McElrea of LQDX 
• Rama Pulligada and Alex Smith, of Brewer Science
• Bob Patti of NHanced Semiconductors
•  John Lannon of Micross 
• Bob Chylak of Kulicke & Soffa  
• Tony Gueli and Venkata Mokkapati of AT&S 
• Kuldip Johal, MKS-Atotech 
• Joel Scutchfield, Koh Young America

Chapters

• 0:00 Tony Gueli and Venkata Mokkapati of AT&S
• 1:08 Mark Gerber and Vivak Gupta, ASE Group
• 9:01 Rao Bonda and Nathan Whitchurch, Amkor Technology, Inc.
• 20:47 Eelco Bergman and Bart Despropo Saras Micro Devices
• 31:41 Simon McElrea, LQDX
• 41:04 Rama Puligada and Alex Smith, of Brewer Science
• 53:17 Bob Patti, NHanced Semiconductor
• 1:06:09 John Lannon, Micross
• 1:17:18 Bob Chylak, Kulicke & Soffa
• 1:26:42 Tony Gueli and Venkata Mokkapati of AT&S
• 1:34:28 Kuldip Johal, MKS-Atotech
• 1:46:19 Joel Scutchfield, Koh Young America